PICMG releases COM-HPC specification

It defines five module sizes to deliver edge server performance for small, rugged data centres and embedded use.

The base specification will be accompanied later this year by a platform management interface specification, COM-HPC EEEP, and a carrier board design guide.

“Twenty-six companies worked together over five years”, said COM-HPC working group chairman Christian Eder. “I owe a big thank you to the team for the dedication and excellence they all brought to the effort.”

COM-HPC does not replace COM Express.

There will be two classes of COM-HPC modules.

• COM-HPC Client Module Type for  high-end embedded client products that need one or more displays
  Typical uses are foreseen in medical equipment, high-end instrumentation, industrial equipment, casino gaming equipment, ruggedised field PCs, transportation and defence systems.
• COM-HPC Server Type for high-end headless (no display) embedded servers with lots of CPU capability, memory and I/O bandwidth – the latter including multiple 10 or 25Gbit/s Ethernet, and up to 65 PCIe lanes at up to Gen 5 speed.
  Typical uses are foreseen in embedded servers ruggedised for field use, autonomous vehicles, outdoor cellular base stations, geophysical field equipment, medical equipment and defence systems.

Both client and server modules have a dedicated platform management interface – the first for a COM standard to include remote administration.

“The new open standard will enable multiple AI and Industry 4.0 applications, amongst others, to be realised by bringing server-level computing to the edge,” said PICMG president Jessica Isquith. “Adopting the specification provides a necessary standard to reduce time to market and stabilize costs for hundreds of solutions providers.”

At a glance

• Two 400-pin high-performance BGA-mount connectors
• Platform management interface
• x86, RISC, FPGA or GPGPU processing
• COM-HPC Client Modules
  Size A: 95 x 120mm
  Size B: 120 x 120mm
  Size C: 160 x 120mm
  Up to 48 + 1 PCI Express Gen4/5 lanes
  Up to 4x USB4
  Up to 4x video interfaces
  Up to 2x 25Gbit/s Ethernet interfaces
• COM-HPC Server Modules
  Size D: 160 x 160mm
  Size E: 200 x 160mm
  Up to 64 + 1 PCI Express Gen4/5 lanes
  Up to 2x USB4
  Up to 4 graphic interfaces / headless
  Up to 8x 25Gbit/s Ethernet interfaces

Adlink, congatec and Kontron sponsor and are on the PICMG COM-HPC committee. Other members include: University of Bielefeld, Acromag, Advantech, Amphenol, AMI, Avnet Integrated (MSC Technologies), Comtel, Duagon (MEN Mikro Elektronik), Elma Electronic, ept, Eurotech, Fastwel, GE Automation, HEITEC, ICC Intelligent Platforms, Intel, N.A.T., nVent, Samtec, SECO, Supermicro, TE Connectivity, Trenz Electronic, and VersaLogic.